Physical design is the bridge between logic design and silicon fabrication. It transforms a verified netlist into a GDSII layout file ready for chip manufacturing. Understanding this flow is essential for every VLSI engineer working on backend design.
Floorplanning defines the chip area, placement of macros (memories, IPs), and pin assignments. Good floorplanning minimizes wire lengths and congestion, directly impacting timing and power.
Power grid design ensures adequate power delivery across the chip. Ring-and-stripe power structures and decoupling capacitors are placed to minimize IR drop and electromigration risks.
Standard cells are placed within the core area. Modern placement tools (Cadence Innovus, Synopsys ICC2) use timing-driven placement algorithms to meet timing constraints while minimizing area.
CTS builds the clock distribution network to minimize clock skew and insertion delay. H-tree and mesh topologies are commonly used. CTS is critical for meeting setup and hold timing.
Global and detailed routing connect all cells using metal layers. Advanced nodes use multiple metal layers (M1-M15+) with strict DRC rules. Signal integrity (crosstalk, noise) is managed during routing.
Final verification includes DRC (Design Rule Check), LVS (Layout vs. Schematic), timing sign-off (STA), and power analysis before GDSII tape-out.
Industry-standard tools include Cadence Innovus, Synopsys IC Compiler II, Mentor Calibre for DRC/LVS, and PrimeTime for STA.
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